Technical requirement (basic) Layer: 2 Material: FR4/TG 135C Material usage: DS>80%, ML>73% Board thickness: 1.6mm Surface treatment: Hot air levering Solder mask: Green Track width/gap: 0.125mm/0.125mm Min hole size: 0.3mm Hole density: <50K holes per squre meters Impedance control: 50ohm +/-10% Furthermore we are able to fulfill following requirements: Material type: FR-4, CEM-3, Halogen-Free, High Tg, CAF material, high CTI, Rogers, Arlon, PI, BT, GETEK, PTFE Surface[...]