Polyimide Film is a common Polyimide film condensed with 4-formic acid-2-anhydride of benzene
and 4,4-diamino-biphenyl-ether oxide .This product has excellent mechanical capability,favorable electric
insulation ,radiation hardening and good dielectric at tempreture as low as -269℃(-452.2℉) and as high
as +260℃(+492℉).
Specification and property:
Property Name H Type Film
Transparent or semi-transparent golden film with smooth and flat surface and
Appearance without any needle cavities ,bubbles or electrically conductive impurities.
Thickness Nominal(um) 20 25 30 40 50 75 100 125 150 175
Thickness Tolerance(um) ±3 ±3 ±3 ±4 ±5 ±7.5 ±10 ±12.5 ±15 ±17.5
Width(mm) 6～1040 6～520
Length(m) 1000±5 500±5 300±5 200±5
Tensile Strength Mpa≥ 140 120
Eleongation at rupture％≥ 40 60
Dielectric Strength≥ MV/m 150 120
Surface Resistivity≥ 200℃ Ώ 1.0×1013
Volume resistivity≥ 200℃,Ώ .Cm 1.0×1015
Dielectric Constant(106H) 3～4
Dielectric Tangent(106H)≤ 1.0×10﹣3